PCB Design Glossary


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0

0201

0201 refers to a part size common to resistors, capacitors, diodes, and other passive components.  An 0201 part is 20 mils (0.020 inches) long and 10 mils (0.010 inches) wide.  These parts are difficult to see without magnification equipment and hand soldering of these parts is all but impossible.  


0402

0402 refers to a part size common to resistors, capacitors, diodes, and other passive components.  An 0402 part is 40 mils (0.040 inches) long and 20 mils (0.020 inches) wide.

These parts are very difficult to solder by hand without the aid of magnification equipment and a very small tipped soldering iron.


0603

0603 refers to a part size common to resistors, capacitors, diodes, and other passive components.  An 0603 part is 60 mils (0.060 inches) long and 30 mils (0.030 inches) wide.  These parts can be seen without magnification and can be soldered by hand with some difficulty.


0805

0805 refers to a part size common to resistors, capacitors, diodes, and other passive components.  An 0805 part is 80 mils (0.080 inches) long and 50 mils (0.050 inches) wide.  These parts can be hand-soldered without too much difficulty.


A

Active Components

Active components can control the power gain in a circuit, usually with a controlling input.  Examples include transistors, vacuum tubes, thyristors.


Advanced Assembly

Advanced Assembly is a PCB Assembly shop in Aurora, Colorado.  Advanced Assembly is a sponsor of this course.

Advanced Assembly Logo

Visit this website here:

https://aapcb.com

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Annular Ring

One of the steps in fabricating a via is to drill holes through a series of parallel circular pads on adjacent layers.  Mathematicians call the copper ring that remains an annulus.  Engineers colloquially call it an annular ring.
From left to right - a buried via, a blind via, a through via, stacked microvia and staggered microvia.


Antipad

Surrounding every pad is an area with no copper that acts as an insulator.  This is called the anti-pad.


AOI

AOI is an initialism that stands for Automated Optical Inspection.  A camera moves rapidly over all areas of the board looking for issue that would affect the quality of the PCB.  If an issue is found, the board is either crossed out or flagged for follow up by a human operator.  

AOI does not detect internal flaws in a PCB.


B

BGA

Ball Grid Arrays are components that connect to a PCB via a rectangular series of pads and solder-balls.

Ball Grid Array



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